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1.
Multichip modules and related Technologies MCM, TAB and COB design Gerald L. Ginsberg and Donald D. Schnorr by Series: Electronic packaging and inter connection series
Material type: Text Text; Format: print ; Literary form: Not fiction
Language: English
Publication details: New York: McGraw-Hill, 1994
Availability: Items available for loan: National Library of India (1)Call number: E 621.381046 G 435.

2.
Multichip Module desingn fabrication and testing/ James J. Licari by Series: Electorinic packaging and inter connection series
Material type: Text Text; Format: print ; Literary form: Not fiction
Language: English
Publication details: New York: McGraw-Hill, 1995
Availability: Items available for loan: National Library of India (1)Call number: E 621.381046 L 616.

3.
Electronic techniques : shop practices and construction / Robert S. Villanucci, Alexander W. Avtgis [and] William F. Megow by
Edition: 5th ed.
Material type: Text Text; Format: print ; Literary form: Not fiction
Language: English
Publication details: Englewood Cliffs, N.J. : Prentice-Hall, c1996
Availability: Items available for loan: National Library of India (1)Call number: E/O 621.381 V 712.

4.
Thermal management handbook for electronic assemblies/ Jerry E. Sergent, Al Krum by Series: Electronic Packaging and Inter Connnection Series
Material type: Text Text; Format: print ; Literary form: Not fiction
Language: English
Publication details: New York: Mc Graw - Hill, c1998
Availability: Items available for loan: National Library of India (1)Call number: E 621.381 Se 66.

                                                                           
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