TY  - BOOK
AU  - Buchler,Martin G.
TI  - Microelectronic test pattern NBS-3 for evaluating the resistivity-dopart density relationship of silicon
U1  -  621.3815 
PY  - 1976///
CY  - Washington, D. C.
PB  - United States Government Printing Office
KW  - Microelectronics
KW  - Electronic circuits
KW  - Electronics
N1  - At the head of the title : Semiconductor measurment technology
ER  -