TY  - BOOK
AU  - Moore,Thomas M.
AU  - McKenna,Robert G.
TI  - Characterization of intergrated circuit packaging materials
SN  - 0750692677
U1  - 621.381046 
PY  - 1993///
CY  - Boston
PB  - Butterworth Heinemann
KW  - Electronic packaging
KW  - Materials
KW  - Integrated ciruits
KW  - Design and construction
N1  - Includes index
ER  -