Characterization of intergrated circuit packaging materials/ 
edited by Thomas M. Moore and Robert G. McKenna 
 - Boston:  Butterworth Heinemann,  c1993 
 - xviii, 274 p.:  ill.;  23 cm. 
 - Materials characterizations series surface interfaces thinthinfilms .
<br/><br/> Includes index 
<br/><br/><label>ISBN: </label>0750692677  £ 50.00 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electronic packaging--Materials<br/>Integrated ciruits--Design and construction
<br/><br/><label>Dewey Class. No.: </label>621.381046