TY  - BOOK
AU  - Pecht,Michael G.
AU  - Nguyen,Luu T.
AU  - Hakim,Edward B.
TI  - Plastic encapsulates microelectronics: mateirals, processes, qualtiy, relaliability and applications
SN  - 0471306258
U1  - 621.381046 
PY  - 1995///
CY  - New York
PB  - John Wiley
KW  - Microelectronic packaging
KW  - Materials
KW  - Microencapsulation
KW  - Plastics in packaging
N1  - Includes index
ER  -