Plastic encapsulates microelectronics:  mateirals, processes, qualtiy, relaliability and applications/ 
edited by Michael G. Pecht, Luu  T. Nguyen and Edward B. Hakim 
 - New York:  John Wiley,  1995 
 - xxxiv, 474 p.;  23 cm. 
<br/><br/> Includes index 
<br/><br/><label>ISBN: </label>0471306258  $ 69.95 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectronic packaging--Materials<br/>Microencapsulation<br/>Plastics in packaging
<br/><br/><label>Dewey Class. No.: </label>621.381046