TY  - BOOK
AU  - Licari,James J.
TI  - Multichip Module desingn fabrication and testing
SN  - 0070377154
U1  - 621.381046 
PY  - 1995///
CY  - New York
PB  - McGraw-Hill
KW  - Electronic Packaging
KW  - Multichip modules (Microelectronics)
KW  - Design and construction
KW  - Testing
N1  - Includes index
ER  -