TY  - BOOK
AU  - Licari,James J.
AU  - Swanson,Dale W.
TI  - Adhesives Technology for Electronic Applications: Materials, Processing, Reliability
SN  - 9781437778892 (ebook)
PY  - 2011///
CY  - Amsterdam
PB  - Elsevier
KW  - Adhesives
KW  - Electronic packaging
KW  - Electronics
KW  - Materials
N1  - Includes bibliographical references and index
UR  - http://www.sciencedirect.com/science/book/9781437778892
ER  -